Press Release

• 15 Sep 2011
  ATE China 2011 Draws to Successful Close
  Three-Day Exposition of Electronics Assembly and Packaging Technologies is a Triumph

  ATE China 2011, organized by Reed Exhibitions and held at the Shenzhen Convention and Exhibition Center with NEPCON South China 2011, recently came to a close. The dual event covered an exhibition area of 37,500 sqm and attracted over 500 local...